Wistron Commits $209M to Texas and Vietnam as AI Server Orders Drive Record August Revenue
Wistron reported a record NT$460.07 billion (US$14.4 billion) in consolidated revenue for August, up 49.3% month-on-month and 166% year-on-year, driven…
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Delta’s Record August Revenue: Why AI Server Power Supplies Are Constraining GPU Deployments
Delta Electronics' August consolidated revenue reached TWD 64.586 billion, a 34.9% year-over-year increase, while Lite-On Technology hit TWD 19.6 billion,…
Winbond’s Chip Testing Outlook: Why Capacity Bottlenecks—Not a Bubble—Limit AI Supply
During SEMICON Taiwan 2026, Winbond VP Chen Shao-kun stated that the AI demand is not a bubble but rather an…
Buding Tech’s NT$740 Listing: How a Taiwan DRAM Spin-off Tackles the HBM 3D Stacking Wall
Buding Technology, a subsidiary of Nanya Technology, is set to list on Taiwan's emerging stock market on September 16 at…
DeepSeek’s $2.56B Huawei Order: Why the AI Pioneer Is Pivoting Away From Nvidia
DeepSeek is reportedly ordering 160,000 Ascend 950DT AI chips from Huawei for a new data center in Inner Mongolia, with…
Micron Plans to Double HBM Production to 100,000 Wafers to Challenge South Korean Memory Dominance
Micron plans to double its monthly High Bandwidth Memory (HBM) wafer production to 100,000 units by the end of 2026.
AI Agent Security Risks: Why 65% of Enterprises Experience Excessive Permission Failures
A new survey by Enterprise Management Associates (EMA) reveals significant gaps in enterprise control over AI agent permissions, with 65%…
The Enterprise AI Pivot: Non-Hyperscale Demand Drives the Shift to Open-Source Models
NVIDIA's latest earnings show its 'AI Cloud, Sovereign AI, Industrial, and Enterprise' segment (ACIE), representing non-hyperscale customers, now accounts for…
TSMC’s Microchannel Cooling: Why Liquid Flowing Through Silicon Decides the AI Chip Thermal Limit
TSMC announced it is incorporating microchannel cooling technology into its R&D roadmap, aiming to integrate it with advanced packaging solutions.
TSMC’s 20-Fab Buildout Fall Short as AI Chip Demand Doubles Equipment Orders
TSMC's Co-COO, C.C. Wei, stated at SEMICON Taiwan 2026 that AI demand is growing at an unprecedented rate, causing equipment…
Taiwan’s Supply Chain Is Bracing for a Record Q4 Export Surge Driven by Next-Gen AI Platforms
UBI Funds predicts strong performance for US, Taiwan, and Korean stock markets in Q4 2026, driven by NVIDIA's GB200 and…
Kintron Technology Expands Glass Substrates to Solve the AI Packaging and CPO Bottleneck
Taiwanese firm Kintron Technology is expanding its Through Glass Via (TGV) substrate and glass micro-processing technologies for AI advanced packaging…
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