Micron’s 100K Wafer HBM Target: Doubling Capacity by 2026 to Challenge Samsung
Micron plans to double its High Bandwidth Memory (HBM) production capacity by the end of 2026, targeting a monthly output of approximately 100,000 wafers.
AsiaAI Publisher
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September 3, 2026 ·
2 min read · Source: 전자신문 ETNews
Semiconductors & Hardware
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Source: Counterpoint Research
Micron plans to double its High Bandwidth Memory (HBM) production capacity by the end of 2026, targeting a monthly output of approximately 100,000 wafers. This aggressive expansion, primarily at its Taiwan and Singapore fabs, focuses on increasing the supply of 12-layer HBM4, a key component for NVIDIA’s next-generation AI accelerators.
Micron’s push to significantly expand HBM capacity comes as demand for AI memory continues to outstrip supply, particularly for the latest HBM4 standard. This move directly challenges the market dominance of Samsung Electronics and SK hynix, who currently hold the largest shares in the HBM market.
