East Asian Technology Intelligence
Japan & China technology, translated and contextualized for Western readers
Apple is widely expected to unveil its first foldable iPhone, possibly named ‘iPhone Ultra,’ at its product announcement event on September 10th at 2 AM JST.
Hanmi Semiconductor Chairman Kwak Dong-shin announced an additional personal share acquisition of 700 million Won, bringing his total personal investment in company shares since 2023 to 72 billion Won (approximately $52.7 million USD).
Wistron reported a record NT$460.07 billion (US$14.4 billion) in consolidated revenue for August, up 49.3% month-on-month and 166% year-on-year, driven by strong AI-related product shipments.
Delta Electronics’ August consolidated revenue reached TWD 64.586 billion, a 34.9% year-over-year increase, while Lite-On Technology hit TWD 19.6 billion, up 25% year-over-year and marking a new single-month high for 2026.
Siemens Digital Industries Software announced an expansion of its ‘Fuse EDA AI Agent’ platform, integrating NVIDIA AI technology to enable autonomous and long-running verification in semiconductor design flows.
The Semiconductor Industry Association (SIA) announced that global semiconductor sales for July 2026 reached $146.8 billion, a 135.1% increase year-over-year.
During SEMICON Taiwan 2026, Winbond VP Chen Shao-kun stated that the AI demand is not a bubble but rather an issue of insufficient supply chain capacity.
Huawei held its autumn product launch, unveiling HarmonyOS 7, the triple-fold Mate XT 2, and other devices.
Infineon Technologies significantly increased its market share in gallium nitride (GaN) power devices, moving from 5th place in 2024 to 2nd in 2025.
SK hynix plans to invest $4 billion to build its first high-bandwidth memory (HBM) advanced packaging plant in Indiana, USA, with mass production of HBM4E chips expected by late 2029.
