Micron Plans to Double HBM Production to 100,000 Wafers to Challenge South Korean Memory Dominance
Micron plans to double its monthly High Bandwidth Memory (HBM) wafer production to 100,000 units by the end of 2026.
AsiaAI Publisher
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September 5, 2026 ·
2 min read · Source: 科技新報 TechNews · Issue #87
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This story ran in Issue #87, alongside three other stories.
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Source: ETNews, Micron 2026 Proj.
Micron plans to double its monthly High Bandwidth Memory (HBM) wafer production to 100,000 units by the end of 2026. This aggressive expansion, primarily focused on 12-layer HBM4, is intended to supply Nvidia’s next-generation Rubin AI hardware. The company is investing heavily in new equipment, already being delivered to its fabs in Taiwan and Singapore.
This move directly challenges SK hynix and Samsung, who currently dominate the HBM market with higher production volumes. Micron’s strategic focus on 12-layer HBM4 signifies its intent to capture a larger share of the high-end AI accelerator memory market, crucial for next-gen GPUs.
