Murata’s iPaS Substrates: Solving the Power Delivery Bottleneck in AI Accelerators
Murata Manufacturing, the world's largest producer of Multi-Layer Ceramic Capacitors (MLCCs), plans to mass-produce its Integrated Package Solution (iPaS) next year.
AsiaAI Publisher
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September 14, 2026 ·
2 min read · Source: 科技新報 TechNews · Issue #96
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This story ran in Issue #96, alongside three other stories.
Semiconductors & Hardware
Murata Manufacturing, the world’s largest producer of Multi-Layer Ceramic Capacitors (MLCCs), plans to mass-produce its Integrated Package Solution (iPaS) next year. iPaS integrates passive components like capacitors and inductors into a multi-layer power substrate to support Vertical Power Delivery (VPD) architectures for AI accelerators, aiming to reduce power loss and free up surface space on chip packages.
As AI accelerator performance increases, so does power consumption and current, making efficient power delivery critical. Traditional power modules around the chip lead to longer paths and greater resistance loss. Murata’s iPaS addresses this by moving power delivery closer, even beneath the chip, aligning with the industry’s need for advanced packaging solutions that can handle high current and thermal demands.
