TSMC’s CoWoS Shortage: Why Nvidia and Cloud Giants Are Sourcing Amkor and UMC Capacity
TSMC plans to double its CoWoS advanced packaging capacity by 2028 to 260,000 wafers per month, up from an estimated…
AsiaAI.FYI
Taiwan Silicon
MediaTek’s August Revenue Surge: Why Nvidia’s $3.5B Bet Precedes the 2nm Dimensity Launch
Taiwanese IC design leader MediaTek reported a record-breaking NT$64.183 billion (approximately US$1.99 billion) in consolidated revenue for August 2026, marking…
China’s AI Chip Price Surge: How the HBM Shortage is Reshaping Domestic Hardware Tariffs
Amid tightening US export controls, Chinese AI chip companies are increasingly relying on grey markets for advanced High Bandwidth Memory…
Wistron Commits $209M to Texas and Vietnam as AI Server Orders Drive Record August Revenue
Wistron reported a record NT$460.07 billion (US$14.4 billion) in consolidated revenue for August, up 49.3% month-on-month and 166% year-on-year, driven…
Delta’s Record August Revenue: Why AI Server Power Supplies Are Constraining GPU Deployments
Delta Electronics' August consolidated revenue reached TWD 64.586 billion, a 34.9% year-over-year increase, while Lite-On Technology hit TWD 19.6 billion,…
Winbond’s Chip Testing Outlook: Why Capacity Bottlenecks—Not a Bubble—Limit AI Supply
During SEMICON Taiwan 2026, Winbond VP Chen Shao-kun stated that the AI demand is not a bubble but rather an…
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