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Top stories: Beijing Floats Key Revisions to Seven-Year-Old E-Commerce Law to Regulate $2.2 Trillion Digital Market · Hugging Face Suffers AI-Driven Cyberattack; AI Defenses Counter, But Commercial Models Block Analysis, Forcing Use of China’s GLM · StepFun Debuts STEPX Neo AI Agent Phone in China, Integrates Alipay, Meituan, Didi, and Baidu for Cross-App Autonomy · Rapidus and Cadence Collaborate on Agentic AI for Advanced-Node SoC Design

Top stories: China’s AI Job Market Sees Surging Demand, High Salaries, and Strict Experience Requirements · Japan Secures Nvidia Chips to Fuel Sovereign Industrial AI Push · Data Reshaping the AI Era in 2026: From Computing Power to Intelligence · East Asian Nations Face Accelerating Population Decline

Top stories: Beijing’s Top Tech Honors Reveal the Playbook for Subsidizing its Chokepoint Counter-Offensive · Anthropic Integrates ‘Claude Fable 5’ into Subscriptions: Max and Team Premium Plans Included · Hangzhou Xunsun Intelligence CEO: AI Software Factory Redefines Software Production From Requirements to Running Systems · TSMC Boosts 2026 Expansion Budget, Adds $100B to U.S. Investment

Top stories: NVIDIA CEO Huang: ‘Japan AI is a Must’; METI Launches New Domestic Physical AI Project, Minister Akazawa Wears ‘Leather Jacket’ · Japan Launches Sovereign ‘Physical AI’ Push Powered by Nvidia and Industrial Giants · Tongyi Qianwen AI Agent Earbuds Debut at WAIC: Real-Time Translation, Meeting Minutes, and Health Tracking in All-Day Wearable Design · SEMI Forecasts Global Chip Equipment Sales to Reach Record $229B in 2028

Top stories: Claude, Codex, and ChatGPT Work: Usage Limits Reset Again Amidst ‘Reset Battle’ · Xiaomi Advances Embodied AI with Factory Deployment and Open-Source Model · TSMC’s Q2 Revenue Up 34% YoY, Plans Another $100 Billion Investment in Arizona Fabs

Top stories: Google DeepMind CEO Hassabis Proposes US-Led ‘Frontier AI Standardization Body’ · Shenzhen Robot Startup LimX Dynamics Hits $2.3B Valuation With $200M Pre-IPO Round · Asahi Kasei Expands Taiwan Facility for Advanced Packaging Materials

Top stories: Microsoft CEO Nadella Warns of ‘Double Cost’ for AI Users: Money and ‘Something Even More Valuable’ · Masayoshi Son’s Grand Vision: Powering the Multi-Trillion-Dollar AI Agent Revolution · Huawei Kirin 2026 Chip Shows 53.5% Transistor Density Leap; Tao Law V2 Delivers Measured Results · Nvidia Halves Asia Buyer List to Prevent AI Chips Reaching China Amid Tighter US Controls

Top stories: TSMC Q2 Revenue Up 36% YoY, Expands Advanced Packaging in Chiayi · How to Achieve Business Automation with Agents? Many New Technologies Announced at Microsoft Build 2026 · OpenHarmony’s Six-Year Transformation: Expanding Ecosystem for Thousands of Industries in China · Tesla A15 Chip to be Fabbed at Samsung and TSMC on 2nm Process

Top stories: Global Storage Expansion and Overseas Delivery Bottlenecks Open Super Era for Chinese Semiconductor Equipment · OpenAI Launches GPT-Live and Slashes Limits as Anthropic Rivalry Intensifies · CSC Financial: Semiconductor Equipment Supply Chain Faces Dual Localization Trend and Major Investment Opportunity · Wayve employees cash in shares worth $85m as Nissan joins Tokyo robotaxi roll-out

Top stories: SK Hynix Debut Is a Bet That AI Breaks Boom-and-Bust Chip Cycle · East Asian Memory Giants Ramp Up Capital to Feed AI Demand · MiniMax: Lock-Up Crash, Then $2.2B Fundraise in 48 Hours · IMF: South Korea, Taiwan, Thailand, Malaysia Lead AI Hardware Export Surge