Huawei’s Ascend 960 SuperPoD: Interconnect Tech Combats U.S. Export Controls
Huawei has launched its Ascend 960 SuperPoD compute cluster and an upgraded UnifiedBus interconnect, capable of linking up to 4,000 processors.
AsiaAI Publisher
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September 17, 2026 ·
2 min read · Source: 科技新報 TechNews · Issue #99
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This story ran in Issue #99, alongside three other stories.
Semiconductors & Hardware
Huawei has launched its Ascend 960 SuperPoD compute cluster and an upgraded UnifiedBus interconnect, capable of linking up to 4,000 processors. This system integrates Near-Packaged Optics (NPO) into the SuperPoD architecture for the first time, aiming to overcome advanced manufacturing limitations by efficiently stacking and connecting existing chips.
This development is crucial for Huawei as it navigates U.S. export controls, which limit its access to advanced semiconductor manufacturing. By focusing on interconnect technology and packaging innovations, Huawei aims to build ultra-large-scale AI data centers with its domestic Ascend chips, reducing reliance on foreign-made advanced process nodes.
