Huawei’s 7.2T Optical Interconnect: A Direct Challenge to Nvidia and Broadcom CPO Standards
Huawei has unveiled its 7.2T NPO (Near-Packaged Optics) solution at the China International Optoelectronic Exposition (CIOE), positioning it as a more viable alternative to Nvidia and Broadcom's CPO (Co-Packaged Optics) technology.
AsiaAI Publisher
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September 13, 2026 ·
2 min read · Source: 科技新報 TechNews · Issue #95
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This story ran in Issue #95, alongside three other stories.
Semiconductors & Hardware
Huawei has unveiled its 7.2T NPO (Near-Packaged Optics) solution at the China International Optoelectronic Exposition (CIOE), positioning it as a more viable alternative to Nvidia and Broadcom’s CPO (Co-Packaged Optics) technology. Huawei emphasizes NPO’s compatibility with existing chip manufacturing supply chains and its easier repairability due to its pluggable nature at the PCB level. The company is actively seeking support from cloud computing operators and suppliers across the US, Japan, China, and Canada to establish NPO as a new industry standard through the Optical Internetworking Forum (OIF).
This move signals Huawei’s ambition to gain influence in the high-bandwidth optical interconnect market, critical for AI data centers and supercomputing. By proposing NPO, Huawei aims to sidestep the complexities and nascent supply chain of CPO, leveraging more mature manufacturing processes and existing infrastructure.
