Samsung Targets 40% HBM Share and Foundry Profitability via Integrated AI Nodes
Analysts project Samsung Electronics' High Bandwidth Memory (HBM) market share to approach 40% in Q4 2026, up from 33% in Q2, driven by increased HBM4 sales.
AsiaAI Publisher
·
September 11, 2026 ·
2 min read · Source: 전자신문 ETNews · Issue #93
East Asian Technology Intelligence
Japan & China tech news — translated, contextualized, and delivered for Western readers.
Free. Unsubscribe anytime.
This story ran in Issue #93, alongside three other stories.
Analysts project Samsung Electronics’ High Bandwidth Memory (HBM) market share to approach 40% in Q4 2026, up from 33% in Q2, driven by increased HBM4 sales. Simultaneously, yield rates for its advanced 4nm and 2nm foundry processes are improving significantly, raising the likelihood of the foundry business turning profitable in Q3 2026. Samsung’s integrated offering of HBM, foundry, and packaging is seen as a key competitive advantage.
Samsung’s success in HBM and advanced foundry processes directly challenges SK hynix’s HBM lead and TSMC’s foundry dominance, critical components of the global AI semiconductor supply chain. Improved yields and an integrated approach could shift market dynamics, affecting sourcing decisions for major Western AI and tech companies.
