Kioxia and Western Digital Plan ¥5T Expansion to Secure AI Memory Supply
Kioxia and its joint venture partner SanDisk have announced a massive ¥5 trillion (over $31 billion USD) investment plan through…
AsiaAI.FYI
Analysis
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Nvidia’s 106% Revenue Surge Signals Sustained Demand for Korean HBM Suppliers
NVIDIA reported Q2 revenue that surpassed analyst expectations, showing a 106% increase compared to the same quarter last year. This…
SK hynix’s Indiana HBM Plant: A 2029 Target That Leaves the Core Fab in Korea
SK hynix has begun construction on its advanced packaging plant in West Lafayette, Indiana, with a goal of starting mass…
Nvidia’s Vera Rubin Bottleneck: Why HBM Suppliers Hold the Key to Its 70% Growth Forecast
Nvidia reported record-breaking fiscal Q2 (May-July) revenue of $96.22 billion, exceeding market forecasts.
Nvidia’s Supply Bottlenecks: How Packaging and Memory Constraints Threaten Its 70% Growth Target
NVIDIA reported Q2 revenue of $96.2 billion, double year-over-year, driven by strong data center performance at $89 billion.
Intel’s Advanced Packaging Gains Traction as TSMC CoWoS Bottlenecks Persist
Analysts suggest TSMC's CoWoS advanced packaging, while a key technology, is becoming a production bottleneck for integrating AI accelerators with…
Nvidia’s Revenue Surge Solidifies HBM Demand for South Korean Chipmakers
Nvidia’s stellar Q2 earnings, featuring a 106% year-on-year revenue surge and eased margin pressure concerns, have reinforced a highly optimistic…
$837B Memory Market Shift: Japan’s Chip Equipment Giants Pivot to AI Bandwidth
Gartner predicts the global semiconductor market will grow 92% year-over-year to $1.555 trillion in 2026, driven by continued AI infrastructure…
SSD Prices to Quadruple by 2026: Why Enterprise Storage Budgets Face an Unprecedented NAND Pinch
The storage market is facing extreme disruption due to a severe shortage and rapid price increases for SSDs.
Arm’s AGI CPU Architecture: Why Agent Workloads Are Driving a $2B Infrastructure Market
Arm has unveiled details of its AGI CPU architecture at the Hot Chips 2026 conference, designed specifically for AI agent…
Nvidia’s $750B AI Financing Risk Triggers Record Rise in Bond Market Credit Swaps
Nvidia is set to announce its Q2 earnings, with projected revenue doubling from 2025 to $92.18 billion, and an estimated…
TSMC’s Advanced Packaging Bottleneck: Intel’s Opportunity to Win AI Foundry Customers
TSMC is reportedly facing challenges with advanced packaging yields for High Bandwidth Memory (HBM), specifically InFO and CoWoS processes, which…
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