Samsung and SK Hynix Split on HBM4, Forcing a Design Choice for AI Chipmakers
At Hot Chips 2026, Samsung Electronics emphasized 'active base die' technology, transforming the HBM base die from a passive connector…
East Asian Technology Intelligence
Japan & China technology, translated and contextualized for Western readers
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At Hot Chips 2026, Samsung Electronics emphasized 'active base die' technology, transforming the HBM base die from a passive connector…
TSMC's latest sustainability report shows its global power consumption is projected to reach 28.77 billion kilowatt-hours (kWh) in 2025, a…
SK hynix detailed its advanced packaging roadmap for High-Bandwidth Memory (HBM) at Hot Chips 2026, focusing on HBM4 and beyond.
Zhongcheng Hualong (中诚华隆) has officially launched its new HL200 AI inference chip and a 'supernode' intelligent computing cluster solution in…
Newsletter Top stories: New Compression Method 'FaCTz' Boosts Supercomputer Data Throughput to 60GB/s, 640x Faster · DeepSeek V4 Flash AI Model…
Researchers have developed a new data compression method called 'FaCTz' that achieves throughputs of up to 60GB/s on NVIDIA A100…
NVIDIA has informed its major customers that prices for its AI server systems will increase by over 15%, effective with…
ASE Technology Holding's wholly-owned subsidiary, ISE Labs, has announced the acquisition of an 80,472 sq ft building in San Jose,…
Venture capital investment in 'Physical AI' startups, encompassing robotics, autonomous vehicles, aerospace, and industrial automation, surged to $47.4 billion in…
Chinese humanoid robot developer Unitree Robotics saw its shares surge 460% on its first day of trading on the Shanghai…
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