Samsung’s High-NA EUV DRAM Roadmap: Why It Is Accelerating Mass Production to 2028
Samsung Electronics and ASML announced an expanded strategic collaboration to introduce high-numerical aperture (NA) EUV lithography for DRAM mass production…
East Asian Technology Intelligence
Japan & China technology, translated and contextualized for Western readers
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Samsung Electronics and ASML announced an expanded strategic collaboration to introduce high-numerical aperture (NA) EUV lithography for DRAM mass production…
Arm introduced three new solutions at its 'Arm Everywhere China' event in Shanghai: Arm CSS for Mobile 2, Arm Neoverse…
SanDisk is advancing High Bandwidth Flash (HBF) memory, which stacks NAND flash silicon dies, as a high-capacity, lower-cost, and lower-power…
The Semiconductor Industry Association (SIA) announced that global semiconductor sales for July 2026 reached $146.8 billion, a 135.1% increase year-over-year.
Infineon Technologies significantly increased its market share in gallium nitride (GaN) power devices, moving from 5th place in 2024 to…
SK hynix plans to invest $4 billion to build its first high-bandwidth memory (HBM) advanced packaging plant in Indiana, USA,…
Chinese robotics company Astribot released a video demonstrating its new 'SmoothRL' technology, a reinforcement learning method enabling robots to learn…
Kioxia presented new flash memory technologies at the FMS event, focusing on solutions for AI-driven data demands.
Taiwan Semiconductor Manufacturing Co. (TSMC) announced on September 2 that its projected manufacturing equipment procurement for 2026 has increased by…
OpenAI has launched its new 'GPT-6 Astra' model, described as its most intelligent and aligned, initially to select organizations and…
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