$4B Indiana Plant: SK hynix Moves Advanced HBM Packaging to U.S. Soil
SK hynix plans to invest $4 billion to build its first high-bandwidth memory (HBM) advanced packaging plant in Indiana, USA, with mass production of HBM4E chips expected by late 2029.
AsiaAI Publisher
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September 7, 2026 ·
2 min read · Source: EE Times Japan · Issue #89
Semiconductors & Hardware
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This story ran in Issue #89, alongside three other stories.
SK hynix plans to invest $4 billion to build its first high-bandwidth memory (HBM) advanced packaging plant in Indiana, USA, with mass production of HBM4E chips expected by late 2029. This move aims to address the concentration of advanced semiconductor packaging capabilities in Asia and support US efforts to strengthen its domestic supply chain. The factory will perform final processing for HBM chips manufactured in Korea, with potential for HBM chip production in Indiana after 2030.
This investment by a major South Korean memory producer directly supports the US CHIPS Act’s goal of bringing more semiconductor manufacturing to American soil, particularly in advanced packaging which is crucial for AI chips. It also highlights a critical vulnerability in the global semiconductor supply chain, where most advanced packaging capacity is concentrated in Asia, despite US leadership in AI chip design.
