TSMC’s CoWoS Shortage: Why Nvidia and Cloud Giants Are Sourcing Amkor and UMC Capacity
TSMC plans to double its CoWoS advanced packaging capacity by 2028 to 260,000 wafers per month, up from an estimated…
East Asian Technology Intelligence
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TSMC plans to double its CoWoS advanced packaging capacity by 2028 to 260,000 wafers per month, up from an estimated…
Taiwanese IC design leader MediaTek reported a record-breaking NT$64.183 billion (approximately US$1.99 billion) in consolidated revenue for August 2026, marking…
Wistron reported a record NT$460.07 billion (US$14.4 billion) in consolidated revenue for August, up 49.3% month-on-month and 166% year-on-year, driven…
Delta Electronics' August consolidated revenue reached TWD 64.586 billion, a 34.9% year-over-year increase, while Lite-On Technology hit TWD 19.6 billion,…
During SEMICON Taiwan 2026, Winbond VP Chen Shao-kun stated that the AI demand is not a bubble but rather an…
Buding Technology, a subsidiary of Nanya Technology, is set to list on Taiwan's emerging stock market on September 16 at…
DeepSeek is reportedly ordering 160,000 Ascend 950DT AI chips from Huawei for a new data center in Inner Mongolia, with…
Micron plans to double its monthly High Bandwidth Memory (HBM) wafer production to 100,000 units by the end of 2026.
A new survey by Enterprise Management Associates (EMA) reveals significant gaps in enterprise control over AI agent permissions, with 65%…
NVIDIA's latest earnings show its 'AI Cloud, Sovereign AI, Industrial, and Enterprise' segment (ACIE), representing non-hyperscale customers, now accounts for…
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