TSMC’s Microchannel Cooling: Why Liquid Flowing Through Silicon Decides the AI Chip Thermal Limit
TSMC announced it is incorporating microchannel cooling technology into its R&D roadmap, aiming to integrate it with advanced packaging solutions.
AsiaAI.FYI
Taiwan
Taiwan Silicon Section
TSMC’s 20-Fab Buildout Fall Short as AI Chip Demand Doubles Equipment Orders
TSMC's Co-COO, C.C. Wei, stated at SEMICON Taiwan 2026 that AI demand is growing at an unprecedented rate, causing equipment…
Taiwan’s Supply Chain Is Bracing for a Record Q4 Export Surge Driven by Next-Gen AI Platforms
UBI Funds predicts strong performance for US, Taiwan, and Korean stock markets in Q4 2026, driven by NVIDIA's GB200 and…
Kintron Technology Expands Glass Substrates to Solve the AI Packaging and CPO Bottleneck
Taiwanese firm Kintron Technology is expanding its Through Glass Via (TGV) substrate and glass micro-processing technologies for AI advanced packaging…
Google’s Taipei Expansion: Why Shilin Is Central to custom TPU and Infrastructure Cycles
Amin Vahdat, Google's Senior VP for AI & Infrastructure, spoke at SEMICON Taiwan 2026, outlining Google's integrated AI infrastructure from…
TSMC’s 20-Fab Global Expansion: Why a Double-Sized Equipment Forecast Strains AI Supply Chains
TSMC Senior VP Jeffrey Hou revealed at SEMICON Taiwan 2026 that AI demand led to a near-doubling of equipment procurement…
Samsung Locks 70% of Memory Capacity to 2031, but Nvidia Still Faces Shortages
Samsung Electronics has reportedly allocated 70% of its memory production capacity through 2031 to long-term agreements (LTAs) with major tech…
Nvidia’s $279B Supply Commitments: Secure Capacities for the Rubin Platform’s 70% Growth Target
NVIDIA reported Q2 FY2027 revenue of $96.22 billion, up 106% year-over-year, with data center revenue reaching $89 billion.
TSMC’s COUPE Roadmap: Integrating Light Sources to Solve the AI Interconnect Bottleneck
TSMC's Dr. Ming-Fa Chen presented updates on the COUPE silicon photonics platform at SEMICON Taiwan 2026, detailing plans to integrate…
Imec’s 2041 Angstrom Roadmap: High-NA EUV Becomes the Standard for Advanced Foundries
Imec, a leading semiconductor R&D center, announced its updated technology roadmap extending to the A2 node by 2041, emphasizing High-NA…
East Asian Technology Intelligence
Japan & China tech news — translated, contextualized, and delivered for Western readers.
Free. Unsubscribe anytime.