Unimicron’s Japan Supply Race: The Scramble to Secure Upstream Glass Fiber and Equipment for AI
Sam J. Hsieh, the new Chairman of Unimicron, a major IC substrate manufacturer, reported that the surge in AI demand is creating critical shortages and increasing complexity in IC substrates and their upstream materials.
AsiaAI Publisher
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September 6, 2026 ·
2 min read · Source: 科技新報 TechNews · Issue #88
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This story ran in Issue #88, alongside three other stories.
Sam J. Hsieh, the new Chairman of Unimicron, a major IC substrate manufacturer, reported that the surge in AI demand is creating critical shortages and increasing complexity in IC substrates and their upstream materials. He stated Unimicron has visited key Japanese suppliers over 10 times with customers to secure expansion plans for ABF substrates, low-thermal expansion glass fiber cloth, and manufacturing equipment.
This highlights a critical bottleneck in the advanced packaging supply chain for AI chips, moving beyond just wafer fabrication and chip-level packaging. Unimicron’s proactive approach with its customers signals the depth of the challenge in securing upstream materials and equipment, particularly from smaller, specialized Japanese suppliers.
