Buding Tech’s NT$740 Listing: How a Taiwan DRAM Spin-off Tackles the HBM 3D Stacking Wall
Buding Technology, a subsidiary of Nanya Technology, is set to list on Taiwan's emerging stock market on September 16 at…
East Asian Technology Intelligence
Japan & China technology, translated and contextualized for Western readers
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Buding Technology, a subsidiary of Nanya Technology, is set to list on Taiwan's emerging stock market on September 16 at…
Sam J. Hsieh, the new Chairman of Unimicron, a major IC substrate manufacturer, reported that the surge in AI demand…
DeepSeek is reportedly ordering 160,000 Ascend 950DT AI chips from Huawei for a new data center in Inner Mongolia, with…
Frank Rohmund, head of Semiconductor Manufacturing Technology at Zeiss, estimates China is 15 years behind in chip manufacturing, specifically in…
Major Chinese semiconductor equipment companies, including Naura, AMEC, and HuaHai Qingke, are expanding their localization efforts from front-end to advanced…
Micron plans to double its monthly High Bandwidth Memory (HBM) wafer production to 100,000 units by the end of 2026.
A new survey by Enterprise Management Associates (EMA) reveals significant gaps in enterprise control over AI agent permissions, with 65%…
NVIDIA's latest earnings show its 'AI Cloud, Sovereign AI, Industrial, and Enterprise' segment (ACIE), representing non-hyperscale customers, now accounts for…
NVIDIA has announced its acquisition of Hugging Face for 17.5 trillion Korean Won.
The global semiconductor equipment market recorded over ₩55 trillion (approximately $40.7 billion) in sales during the second quarter of 2026,…
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