TSMC’s Microchannel Cooling: Why Liquid Flowing Through Silicon Decides the AI Chip Thermal Limit
TSMC announced it is incorporating microchannel cooling technology into its R&D roadmap, aiming to integrate it with advanced packaging solutions.
East Asian Technology Intelligence
Japan & China technology, translated and contextualized for Western readers
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TSMC announced it is incorporating microchannel cooling technology into its R&D roadmap, aiming to integrate it with advanced packaging solutions.
The rapid increase in power consumption and heat generation from high-performance AI semiconductors, particularly high bandwidth memory (HBM) and specialized…
TSMC's Co-COO, C.C. Wei, stated at SEMICON Taiwan 2026 that AI demand is growing at an unprecedented rate, causing equipment…
Micron plans to double its High Bandwidth Memory (HBM) production capacity by the end of 2026, targeting a monthly output…
UBI Funds predicts strong performance for US, Taiwan, and Korean stock markets in Q4 2026, driven by NVIDIA's GB200 and…
Taiwanese firm Kintron Technology is expanding its Through Glass Via (TGV) substrate and glass micro-processing technologies for AI advanced packaging…
TSMC Senior VP Jeffrey Hou revealed at SEMICON Taiwan 2026 that AI demand led to a near-doubling of equipment procurement…
Amin Vahdat, Google's Senior VP for AI & Infrastructure, spoke at SEMICON Taiwan 2026, outlining Google's integrated AI infrastructure from…
Samsung Electronics has reportedly allocated 70% of its memory production capacity through 2031 to long-term agreements (LTAs) with major tech…
NVIDIA reported Q2 FY2027 revenue of $96.22 billion, up 106% year-over-year, with data center revenue reaching $89 billion.
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