Packaging, Test & Substrates

Company	Region	Sector	AI layer	Listing	Revenue	Index rank
TSMC 台積電 The world's leading contract chipmaker, supplying the advanced logic fabrication and CoWoS packaging required for AI accelerators, server processors, and networking silicon.	Taiwan	Foundry & Chip Manufacturing	Silicon & Foundry, AI Server Hardware	TWSE: 2330	US$122B	#3
ASE Technology 日月光投控 Taiwan's largest outsourced semiconductor assembly and test provider, delivering the advanced packaging and testing services required to commercialize AI accelerators and high-performance computing chips.	Taiwan	Packaging, Test & Substrates	Silicon & Foundry, AI Server Hardware	TWSE: 3711	NT$645.388 billion	#7
KYEC 京元電子 A Taiwan-based outsourced semiconductor test specialist providing critical wafer probing, final test, and high-power burn-in services for AI GPUs and high-performance computing chips.	Taiwan	Packaging, Test & Substrates	Silicon & Foundry, AI Server Hardware	TWSE: 2449	NT$34.933 billion	#23
Samsung Electro-Mechanics 삼성전기 A South Korean electronic-components manufacturer supplying multilayer ceramic capacitors for AI servers and FC-BGA package substrates for AI accelerators and data-center processors.	South Korea	Electronic Components	Power & Infrastructure, AI Server Hardware, Edge AI & Devices	KRX: 009150 (Ordinary shares)	Korean won 11.3145 trillion	#27
Chipbond 頎邦 A Taiwan-listed outsourced semiconductor assembly and test provider specializing in display-driver IC back-end services for consumer and edge devices.	Taiwan	Packaging, Test & Substrates	Silicon & Foundry, Edge AI & Devices	TPEx: 6147	NT$21.454 billion	#93
LG Innotek LG이노텍 A major South Korean electronics-components manufacturer supplying optical modules and advanced semiconductor package substrates for AI accelerators and servers.	South Korea	Electronic Components	AI Server Hardware, Edge AI & Devices	KRX: 011070	KRW 21.897 trillion	#103

Revenue is the latest full fiscal year in each profile. Companies without a US-dollar figure show their reporting currency and sort last.

Bold: the company's main layer. Regular: a layer it also works in.

Silicon & Foundry

Chip design, manufacturing, memory, and packaging

• TSMC Taiwan
• ASE Technology Taiwan
• KYEC Taiwan
• Chipbond Taiwan

AI Server Hardware

Servers, boards, components, cooling, and racks

• TSMC Taiwan
• ASE Technology Taiwan
• KYEC Taiwan
• Samsung Electro-Mechanics South Korea
• LG Innotek South Korea

Power & Infrastructure

Energy, batteries, networks, and data-center facilities

• Samsung Electro-Mechanics South Korea

Edge AI & Devices

Phones, vehicles, robots, and devices running AI locally

• Samsung Electro-Mechanics South Korea
• Chipbond Taiwan
• LG Innotek South Korea

Bold names have this as their primary layer. Many companies span more than one.