Japan’s ¥20T AI Robotics Strategy: The New Plan to Challenge U.S. and China Hegemony
Japan’s government has unveiled an “AI Robotics Strategy” aiming to position the country as a leading “third pole” in AI robotics, alongside the US and China.
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Trend Micro’s AI Cyber Warning: Why the Traditional Kill Chain Fails Western Supply Chains
According to Tom Kellermann, VP of Security and Threat Research at TrendAI (Trend Micro), the traditional linear ‘cyber kill chain’ defense is no longer effective against AI-driven attacks.
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Samsung and SK Hynix Split on HBM4, Forcing a Design Choice for AI Chipmakers
At Hot Chips 2026, Samsung Electronics emphasized ‘active base die’ technology, transforming the HBM base die from a passive connector into an active logic chip using 4nm logic processes.
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TSMC’s Power Demand Will Hit 28.8B kWh in 2025, Consuming 10% of Taiwan’s Electricity
TSMC’s latest sustainability report shows its global power consumption is projected to reach 28.77 billion kilowatt-hours (kWh) in 2025, a 12.6% increase from 2024.
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SK hynix’s HBM4 Packaging Roadmap: Doubling TSVs to Meet Western AI Accelerator Demand
SK hynix detailed its advanced packaging roadmap for High-Bandwidth Memory (HBM) at Hot Chips 2026, focusing on HBM4 and beyond.
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Zhongcheng Hualong’s 10K-Card Supernode: How China Scales AI Inference Without Advanced U.S. Chips
Zhongcheng Hualong (中诚华隆) has officially launched its new HL200 AI inference chip and a ‘supernode’ intelligent computing cluster solution in Beijing.
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Taiwan’s FaCTz Compression: How 60GB/s GPU Data Throughput Unlocks Scientific AI Bottlenecks
Researchers have developed a new data compression method called ‘FaCTz’ that achieves throughputs of up to 60GB/s on NVIDIA A100 GPUs for scientific data. This method is designed to keep pace with
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Nvidia’s 15% AI Server Price Hike: How HBM Supply Bottlenecks Impact Western Infrastructure Budgets
NVIDIA has informed its major customers that prices for its AI server systems will increase by over 15%, effective with shipments from early next year. This increase includes systems based on the
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ASE’s Silicon Valley Expansion: How a $29M Building Buy Secures U.S. Chip Packaging
ASE Technology Holding’s wholly-owned subsidiary, ISE Labs, has announced the acquisition of an 80,472 sq ft building in San Jose, California, for $29.53 million (approximately TWD 950 million). This
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Physical AI’s $47.4B Funding Surge: Why Software VCs Are Pivot-Investing in Hardware and Robotics
Venture capital investment in ‘Physical AI’ startups, encompassing robotics, autonomous vehicles, aerospace, and industrial automation, surged to $47.4 billion in the first half of 2026, an 80%