$4B Indiana Plant: SK hynix Moves Advanced HBM Packaging to U.S. Soil
SK hynix plans to invest $4 billion to build its first high-bandwidth memory (HBM) advanced packaging plant in Indiana, USA,…
East Asian Technology Intelligence
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SK hynix plans to invest $4 billion to build its first high-bandwidth memory (HBM) advanced packaging plant in Indiana, USA,…
Chinese robotics company Astribot released a video demonstrating its new 'SmoothRL' technology, a reinforcement learning method enabling robots to learn…
Kioxia presented new flash memory technologies at the FMS event, focusing on solutions for AI-driven data demands.
Sam J. Hsieh, the new Chairman of Unimicron, a major IC substrate manufacturer, reported that the surge in AI demand…
Taiwan Semiconductor Manufacturing Co. (TSMC) announced on September 2 that its projected manufacturing equipment procurement for 2026 has increased by…
OpenAI has launched its new 'GPT-6 Astra' model, described as its most intelligent and aligned, initially to select organizations and…
NVIDIA has announced a landmark $12.93 billion acquisition of Hugging Face, the open-source platform hosting AI models for over 18…
Sony's CMOS image sensor (CIS) market share has reached approximately 50% globally, according to a recent Yole Group survey, matching…
Samsung Electronics has announced a significant expansion of its strategic collaboration with Broadcom in AI memory and foundry technologies.
Japan's Ministry of Defense has submitted a record-high budget request of ¥8.89 trillion (approximately $57 billion USD) for fiscal year…
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