Arm Expands CSS and Total Design to Target AI Infrastructure and Robotics
Arm introduced three new solutions at its 'Arm Everywhere China' event in Shanghai: Arm CSS for Mobile 2, Arm Neoverse…
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Analysis
Every signal essay and story, newest first — East Asian technology read from primary sources, written for Western readers.
Samsung’s High-NA EUV DRAM Roadmap: Why It Is Accelerating Mass Production to 2028
Samsung Electronics and ASML announced an expanded strategic collaboration to introduce high-numerical aperture (NA) EUV lithography for DRAM mass production…
SanDisk’s HBF Halves GPU Requirements for AI Inference by Outperforming HBM Capacity
SanDisk is advancing High Bandwidth Flash (HBF) memory, which stacks NAND flash silicon dies, as a high-capacity, lower-cost, and lower-power…
ASML’s Hyper-NA EUV Roadmap Pushes Japan’s Semiconductor Supply Chain to Align on Standards
ASML announced its lithography technology roadmap, detailing the progression from current 0.33 NA (numerical aperture) EUV systems to 0.55 High-NA,…
Apple’s Foldable iPhone Launch: A 10M-Unit Windfall for East Asian Display and Material Suppliers
Apple is widely expected to unveil its first foldable iPhone, possibly named 'iPhone Ultra,' at its product announcement event on…
Siemens’ Fuse EDA AI Agent: Japan’s Autonomous Verification Bet to Save the Rapidus 2nm Timeline
Siemens Digital Industries Software announced an expansion of its 'Fuse EDA AI Agent' platform, integrating NVIDIA AI technology to enable…
Japan’s Chip Sales Surge 50.8% as Global Semiconductor Demand Breaks Annual Records in Seven Months
The Semiconductor Industry Association (SIA) announced that global semiconductor sales for July 2026 reached $146.8 billion, a 135.1% increase year-over-year.
Infineon’s GaN Market Surge: How AI Server Power Demands Are Reshaping the Chip Supply Chain
Infineon Technologies significantly increased its market share in gallium nitride (GaN) power devices, moving from 5th place in 2024 to…
$4B Indiana Plant: SK hynix Moves Advanced HBM Packaging to U.S. Soil
SK hynix plans to invest $4 billion to build its first high-bandwidth memory (HBM) advanced packaging plant in Indiana, USA,…
Chinese Robotics Vendors Bypass Simulations with Real-World Reinforcement Learning
Chinese robotics company Astribot released a video demonstrating its new 'SmoothRL' technology, a reinforcement learning method enabling robots to learn…
Kioxia Plans to Replace Pricey AI DRAM With CXL Flash Memory Modules
Kioxia presented new flash memory technologies at the FMS event, focusing on solutions for AI-driven data demands.
Unimicron’s Japan Supply Race: The Scramble to Secure Upstream Glass Fiber and Equipment for AI
Sam J. Hsieh, the new Chairman of Unimicron, a major IC substrate manufacturer, reported that the surge in AI demand…
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