Winbond’s Chip Testing Outlook: Why Capacity Bottlenecks—Not a Bubble—Limit AI Supply
During SEMICON Taiwan 2026, Winbond VP Chen Shao-kun stated that the AI demand is not a bubble but rather an issue of insufficient supply chain capacity.
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Huawei and Xiaomi Dual Launches: China’s Next-Gen Foldables and EV Tech Hit the Market Together
Huawei held its autumn product launch, unveiling HarmonyOS 7, the triple-fold Mate XT 2, and other devices.
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Infineon’s GaN Market Surge: How AI Server Power Demands Are Reshaping the Chip Supply Chain
Infineon Technologies significantly increased its market share in gallium nitride (GaN) power devices, moving from 5th place in 2024 to 2nd in 2025.
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$4B Indiana Plant: SK hynix Moves Advanced HBM Packaging to U.S. Soil
SK hynix plans to invest $4 billion to build its first high-bandwidth memory (HBM) advanced packaging plant in Indiana, USA, with mass production of HBM4E chips expected by late 2029.
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Chinese Robotics Vendors Bypass Simulations with Real-World Reinforcement Learning
Chinese robotics company Astribot released a video demonstrating its new ‘SmoothRL’ technology, a reinforcement learning method enabling robots to learn precisely from their actions while continuously operating in real-world environments.
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Buding Tech’s NT$740 Listing: How a Taiwan DRAM Spin-off Tackles the HBM 3D Stacking Wall
Buding Technology, a subsidiary of Nanya Technology, is set to list on Taiwan’s emerging stock market on September 16 at a reference price of NT$740 per share.
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Unimicron’s Japan Supply Race: The Scramble to Secure Upstream Glass Fiber and Equipment for AI
Sam J. Hsieh, the new Chairman of Unimicron, a major IC substrate manufacturer, reported that the surge in AI demand is creating critical shortages and increasing complexity in IC substrates and their upstream materials.
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DeepSeek’s $2.56B Huawei Order: Why the AI Pioneer Is Pivoting Away From Nvidia
DeepSeek is reportedly ordering 160,000 Ascend 950DT AI chips from Huawei for a new data center in Inner Mongolia, with an estimated total value of $2.56 billion.
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China’s Lithography Tech Is 15 Years Behind Western Equipment Suppliers
Frank Rohmund, head of Semiconductor Manufacturing Technology at Zeiss, estimates China is 15 years behind in chip manufacturing, specifically in developing EUV lithography machines.
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Kioxia Plans to Replace Pricey AI DRAM With CXL Flash Memory Modules
Kioxia presented new flash memory technologies at the FMS event, focusing on solutions for AI-driven data demands.